Electronic systems are experiencing rapid changes in performance specifications and form factors, along with numerous supply chain bottlenecks. One system level design problem has been consistent throughout—balancing the form factor tradeoffs between the analog and digital circuitry for maximum software/system flexibility (from sensor to the digital processing units’ input/output).

This fundamental problem requires the system designer to partition (or combine) various circuit components that would allow for maximum softwarization. Now, as the future of advanced ATP technologies accelerate system design implementations from hardware to software centricity; Teledyne e2v’s advanced ATP/SiP expertise revolutionizes system level design for maximum flexibility and multi-mission capability.

Using state-of-the-art technologies (e.g. flip chip, organic packages, etc.) for RF, Mixed-Signal, and Digital Processing applications for use in: industrial, medical, avionic, instrumentation, telecommunication, defense, and space applications are realized. Teledyne e2v’s 40+ years of experience in advanced ATP/SiP technologies gives system designers the highest performance and production flexibility for electronic system platform developments.

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