Space Radiation Tolerant 4GB/8GB DDR4

DDR4 ideal companion-chip for Edge computing processing devices

DDR4 ideal Companion-chips for Space grade devices such as processors, FPGAs SiP solutions & beyond…

The 4/8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.
This space-grade DDR4 memory enables elevated levels of performance, while taking up minimal board real estate – something that is certain to be of value in highly space-constrained, densely-packed satellite designs. It can be used in conjunction with processors and FPGAs having a DDR4 controller, and is also available embedded on Teledyne e2v Space version of Qormino® Common Compute Platform together with a Space version of LS1046 quad-core processor (QLS1046-4GB). Together with the DDR4 memory, a complete radiation and application datapackage is available allowing designers to develop their board quickly and with minimum risk.

Space Key Features
Space Qualification
• Up to NASA Level 1 (based on NASA EEE-INST-002 – Section M4 – PEMs)
• Up to ECSS Class 1 (ECSS-Q-ST-60-13C)

Radiation Tolerance
• SEL LET Threshold > 60.88 MeV.cm²/mg
• SEU evaluated from LET 2.6 MeV.cm²/mg & Upset cross-section @ 60.88 MeV.cm²/mg = 8.73E-12 cm²/bit
• SEFI evaluated from LET 2.6 MeV.cm²/mg & SEFI cross-section @ 60.88 MeV.cm²/mg = 4.17E-4 cm²/device
• TID: 100 krad(Si)

High Performances, Compact, and Fault Tolerant
• 4GB and 8GB densities;
• 72 bits bus width - (Can typically be used as 64 bits data + 8 bits ECC, offering single-bit error correction, and dual-bit error detection)
• 2.1 GT/s and 2.4GT/s (up to 150Gbps) transfer speeds
• Dimensions 15mm x 20mm x 1.92mm
• Temperature range [-40 ; +105]°C or [-55 ; +125]°C

The world’s most compact Radiation Tolerant DDR4 memory for space systems

Teledyne e2v Semiconductors introduces the world’s most compact Radiation Tolerant DDR4 memory for space systems, a solution with a complete application data package, which is the ideal high speed companion chip for Teledyne e2v’s Space Grade Processors or third-party Space FPGAs. This memory successfully stands up to the most extreme environments, functioning resiliently despite severe temperature variations and radiation exposure.

Document Description Type
Datasheet DDR4T DS 60S 219460 F PDF
Document Description Type
NE 26S 220040 100krad TID report for DDR4T04G72 Rev A PDF

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