Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

• Package type options: Wire Bond, Flip-chip, BGA, SiP, MCM,…
• Tailor-made approach
• Low and medium volume
• Hi-Rel / High-end / Specific Assembly & Test
• Supported products: Microprocessors, FPGAs, Asics, Data Converters, image Sensors…
• Semiconductor Lifecycle Management: Support of obsolete solutions, such as SnPb devices
• Segregation of data and flow as per customer request
• Industrialization Manufacturing Services Factory Tour

This short video shows an overview of our INDUSTRIALIZATION and MANUFACTURING SERVICES and how Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

#Industrialization #Manufacturing #Semiconductor #Test #Service