Manufacturing services

Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

  • Package type options: Wire Bond, Flip-chip, BGA, SiP, MCM,…
  • Tailor-made approach
  • Low and medium volume
  • Hi-Rel / High-end / Specific Assembly & Test
  • Supported products: Microprocessors, FPGAs, Asics, Data Converters, image Sensors…
  • Semiconductor Lifecycle Management: Support of obsolete solutions, such as SnPb devices
  • Segregation of data and flow as per customer request
  • Industrialization Manufacturing Services Factory Tour

This short video shows an overview of our INDUSTRIALIZATION and MANUFACTURING SERVICES and how Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

#Industrialization #Manufacturing #Semiconductor #Test #Service

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