Manufacturing services

Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

Package type options: Wire Bond, Flip-chip, BGA, SiP, MCM,…
Tailor-made approach
Low and medium volume
Hi-Rel / High-end / Specific Assembly & Test
Supported products: Microprocessors, FPGAs, Asics, Data Converters, image Sensors…
Semiconductor Lifecycle Management: Support of obsolete solutions, such as SnPb devices
Segregation of data and flow as per customer request
Industrialization Manufacturing Services Factory Tour

This short video shows an overview of our INDUSTRIALIZATION and MANUFACTURING SERVICES and how Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

#Industrialization #Manufacturing #Semiconductor #Test #Service