High level of compliance & reliability cannot be achieved without relevant testing. Through years Teledyne e2v Grenoble has acquired deep knowledge of the failure mechanisms and the associated tests. Each of our packaging technology or assembly process is fully qualified prior to implementation.

In addition our Process & Quality engineers can help you define the optimum test plan for your specific application or product.

  • Bond strength (bond pull & ball shear)
  • Fine and gross leak
  • Lead finish adhesion
  • Mechanical shock
  • Partical impact noise detection (PIND)
  • Resistance to solvents
  • Solderability
  • Thermal shock
  • Constant acceleration
  • C SAM
  • Internal vapor Content / Residual Gas Analysis (RGA)
  • Lead integrity
  • Moisture resistance
  • Moisture Sensitivity Level (MSL) preconditioning
  • Resistance to solder heat
  • Salt atmosphere
  • Temperature cycling
  • Vibration

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