• Test program transfer or development
  • Wafer probe & Final Test interfaces design & manufacturing
  • Qualification : Life-Test & environmental testing
  • Specific packing
Wide Variety of State-of-the-art Testers
  • Digital ICs: Teradyne J971, J973, Tiger, Ultraflex, Ultraflex2 (end of 2017)
  • Mixed & RF ICs: Teradyne A585, National Instruments STS (early 2018)
  • Image sensors: Teradyne A565IH, dedicated test-benches

  • Wafer probe test : -40°C to +125°C (-55°C to 200°C with EG6000)
  • Package Test : -55°C to +125°C (and up to +220°C)
  • 24h operation for ultimate responsiveness
    Monitoring with F.I.R.M.S.
Low/High Temperature Handler and Probers
  • Electroglas EG4090 and EG6000 probers up to 12’’ wafers
  • Turbo Flex Delta Design, MT9510 Multitest for a large range of ceramic & plastic packages
High Performance Logic IC Thermal Characterization Unit : Delta Design ETC 2000, Max TC / Flex TC for debug/characterization & manual test

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