A System in Package integrates a number of ICs into a highly compact package that functions as a unit. There is a huge trend in microelectronics towards System in Package, heterogeneous integration. HiRel / Space is highly concerned, as low and medium volumes prohibit the development of System on Chip (SoC).
SiP is a concept, not a package type or a technology with infinite potential configurations!
Teledyne e2v brings its knowledge and heritage in producing components and systems for high-end markets to meet customers’ expectations for highly integrated devices.
Our manufacturing, inspection & test flow can be tailored to your needs, ranging from product specific flow to full compliance with ESCC 9000 or Mil Prf 38535 QML Class-V / QML Class-Y.
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