We have the experience of designing and creating flip-chip packages using state-of-the-art machinery and materials, developing hermetic or non-hermetic ceramic solutions.
- Thermal Interface Material (TIM) lids or lidless solutions
- SMT – Leaded and RoHS
- Seals – Kovar (hermetic), Copper (non-hermetic)
High lead PbSn 90/10, 95/5
- Package material options include Alumina, Aluminium Nitride and HiTCE
- Available for solutions up to 45x45mm, 1752 I/Os
With over 35+ years’ experience of developing ICs, we have a long history of developing wire bonded solutions.
- Wire bond in Aluminium or Gold
- SMT – Leaded or RoHS
- Seal options include: AuSn, Glass, Seam, Epoxy, Window or Dam & Fill
- Die attachment – Cyanate ester, Silver glass or Epoxy
- Mono or Multi Die (MCM/SiP)
- Package material options include: Alumina, Aluminium Nitride, HiTCE, Organic, LTCC