Packaging

Part of an ecosystem:
  • 25 years partnership with major package/substrate suppliers
  • 2 SiP Design Houses partnerships
Package design capabilities:
  • Routing: Cadence APD, Autocad
  • Ansys HFSS (3D electromagnetic simulation),
  • Ansys thermal simulation
    HSSL up to 12 Gbps

Flip-Chip

We have the experience of designing and creating flip-chip packages using state-of-the-art machinery and materials, developing hermetic or non-hermetic ceramic solutions.

  • Thermal Interface Material (TIM) lids or lidless solutions
  • SMT – Leaded and RoHS
  • Seals – Kovar (hermetic), Copper (non-hermetic)
  • Connections:
    High lead PbSn 90/10, 95/5
    Eutectic SnPb
  • Package material options include Alumina, Aluminium Nitride and HiTCE
  • Available for solutions up to 45x45mm, 1752 I/Os
Wire bond

With over 35+ years’ experience of developing ICs, we have a long history of developing wire bonded solutions.

  • Wire bond in Aluminium or Gold
  • SMT – Leaded or RoHS
  • Seal options include: AuSn, Glass, Seam, Epoxy, Window or Dam & Fill
  • Die attachment – Cyanate ester, Silver glass or Epoxy
  • Mono or Multi Die (MCM/SiP)
  • Package material options include: Alumina, Aluminium Nitride, HiTCE, Organic, LTCC

Wafer sawing
  • Fully automatic Wafer saw of substrates up to 8” diameter and down to 300µm in thickness (Working closely with our partner companies OMS can offer 12” dicing solution)
  • Advanced cleaning solution (Atomizing Nozzle, Dicing Fluid)
  • Programmable water resistivity
  • Multi-Project Wafers
  • Optimised process for sawing and washing for sensitive device
Optical inspection
  • Compatible up to 300 mm wafer size, waffle pack and Gelpack
  • Highly skilled operators inspect the wafer in accordance with standards or dedicated specifications
  • Semi-automated defect inspection machine
  • Great experience on different technology (CMOS, CCD, bumped wafer…)

  • Full auto, Multi material die attach (epoxy, cyanate ester, silver glass)
  • MCM (Multi Chip Module) solutions
  • Large die assembly capability and high placement accuracy (in line control)
  • Furnace and oven with controlled atmosphere
  • ISO 5 oven for glue curing

  • Full auto, Multi material die attach (epoxy, cyanate ester, silver glass)
  • MCM (Multi Chip Module) solutions
  • Large die assembly capability and high placement accuracy (in line control)
  • Furnace and oven with controlled atmosphere
    ISO 5 oven for glue curing

  • Full automatic flip chip machine, wafer up to 300 mm , gel pack and waffle pack
  • Eutectic and Hi-lead bump (Rohs on demand)
  • HiTCE, Al2O3 and AlN ceramic (organic on demand)
  • Die size up to 450mm2, more than 7000 bumps
  • 12 area controlled atmosphere reflow furnace
  • Full Automatic flux cleaner
  • Hot Die shear process

  • Full automatic dispensing and jetting machine with controlled parameters
  • Plasma cleaning
  • Underfill solutions compatible with large die
  • ISO 5 clean room oven

  • Automatic printing machine
  • 3D screen printing technology
  • Full automatic Chip Shooter for SMD attach
  • Single package and panel process
  • Multi Zone oven with controlled atmosphere
  • Ball attach : SnPb (high lead & eutectic), SAC305, polymer balls

  • Full automatic dispensing machine with controlled parameters
  • Plasma cleaning
  • Epoxy & silicone
  • Compatible with non hermetic & hermetic sealing
  • ISO 5 Clean room oven

Hermetic
  • Automatic Seam Sealing with controlled N2 atmosphere (Glove Box)
  • AuSn reflow hermetic sealing under inert gas atmospheres including N2, N2H2
  • Desoxidation process for better moisture level (RGA / vapor content compliant with Mil Std 883 requirement)
Non-hermetic
  • Adhesive sealing
  • Image sensors: glass window sealing
  • Flip Chip devices: heat spreader / metal lid sealing
  • Dam & Fill
  • Versatile low cost solution for sealing

 

  • Marking: pad printing and laser solutions
  • Trim & Form
  • Full automatic hot solder dipping
  • Leak test (fine & gross leak)
  • PIND test

  • Heated Die shear machine, Wire pull test, ball shear
  • 3D measurement machine
  • Micro focus Xray inspection
  • C SAM (acoustic microscopy, 10µm resolution)
  • SEM with integrated EDX
  • High-performance X-ray fluorescence instruments

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